Patented technology platform, adapted from semiconductor manufacturing, & licensed to industry leaders to create the world’s most advanced surgical cutting instruments.
The Problem
Clinical & Financial Constraints of 100+ Year Old Tech
For over a century, the cutting surfaces used in surgery have barely evolved.
Across medical device applications, traditional surface finishing methods have not kept pace with the performance demands of modern surgery. Grinding, coarse abrasion, and standard polishing leave behind microscopic defects, burrs, and inconsistent surface geometries that increase tissue drag, accelerate wear, and limit long-term device performance.
See the Planatome Difference
Ground Edge
Conventional blade surface roughness Ra = 5,000 – 50,0000 nm
Nano-Polished Edge
Planatome blade surface roughness Ra = 5 – 20 nm
The Technology Advantages
Leverages chemical mechanical planarization (CMP)
Nano-polishes to the molecular level
Reduces average surface roughness by 1,000x vs conventional blades1
Ground Edge
The rough edges of conventional blades tear and damage soft tissue.
Nano-Polished Edge
The Planatome nano-polished cutting edge creates clean incisions
The Clinical Advantage
Accelerates healing2,5
90% of the incision was healed in 72 hours vs 10% with standard scalpels2
25% recovery of nerves cut with a nano-polished blade at 5 weeks vs only 9% with a standard blade5
Presented at LSI USA ’26, this session highlights how Planatome is driving the next wave of MedTech innovation, advancing surgical performance, improving patient outcomes, and setting a new standard for device manufacturing.
Technology Convergence: The Planatome Story
Planatome, LLC is a medical device technology company that invested millions of dollars in adapting atomic-level polishing from the semiconductor industry and patenting it for surgical cutting instruments.